SMT-II by Teknek creates a new benchmark in SMT board cleaning.  With Low Static Cleaning and Low Applied Pressure, SMT-II creates the perfect method for removing contamination before solder paste print.  Industry demands for increased traceability and integration have been addressed, SMT-II comes with IPC Hermes as standard.

Features and Benefits

• Patented elastomer and adhesive technology
• Standard IPC-Hermes-9852 or SMEMA capability
• Simple to use graphics user interface