host posted on April 15, 2010 22:12
In the semiconductor manufacturing industry, damage and yield losses attributed to the effects of static charges are well documented, along with the determination of many of the specific causes1. If ESD controls are not implemented properly, integrated circuits in handling equipment (IC handlers) can be subjected to Charged Device Model (CDM),
In the semiconductor manufacturing industry, damage and yield losses attributed to the effects of static charges are well documented, along with the determination of many of the specific causes1. If ESD controls are not implemented properly, integrated circuits in handling equipment (IC handlers) can be subjected to Charged Device Model (CDM), First, to hold semiconductor wafers in place and to facilitate subsequent operations at wafer sawing, back grinding, scribing and breaking, wafer probing, die attach, and various pick and place operations, typical semiconductor procedures include the mounting of wafers on a sheet of adhesive tape material (blue tape is common) that is held in place by an outer metal ring assembly. As the adhesive tapes are insulative, they become highly charged whenever contact is made with the material. Charges of 20Kv and higher are typical from even just slight contact and separation (rubbing). This charging of the adhesive tape material, in turn, causes the wafer to become charged inductively. The devices on the wafer can be subsequently damaged when discharged by any large conductor such as operators, metal fixtures, robot arms, stages and chucks, etc.
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